SHENZHEN XINKEWEI ELECTRONICS CO., LTD.

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    115-83-304-41-001101

    115-83-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    3,978 0.04
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-304-31-012101

    614-87-304-31-012101

    CONN IC DIP SOCKET 320POS GOLD

    Preci-Dip

    3,072 0.04
    RFQ
    614-87-304-31-012101

    Datasheet

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 320 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-304-41-003101

    116-87-304-41-003101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    1,171 0.04
    RFQ
    116-87-304-41-003101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-304-41-117101

    114-83-304-41-117101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    3,464 0.04
    RFQ
    114-83-304-41-117101

    Datasheet

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-306-41-117101

    114-87-306-41-117101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,657 0.04
    RFQ
    114-87-306-41-117101

    Datasheet

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-306-41-134161

    114-87-306-41-134161

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,857 0.04
    RFQ
    114-87-306-41-134161

    Datasheet

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-304-41-005101

    110-83-304-41-005101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,991 0.04
    RFQ
    110-83-304-41-005101

    Datasheet

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-306-41-001101

    115-87-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    1,530 0.04
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-308-41-005101

    110-87-308-41-005101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    4,307 0.04
    RFQ
    110-87-308-41-005101

    Datasheet

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-306-41-003101

    115-87-306-41-003101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,688 0.04
    RFQ
    115-87-306-41-003101

    Datasheet

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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